Flexible circuit board manufacturing capability:
Layers: 1-8
Finished board thickness: 0.06mm-2.5mm
Single and double-sided FPC: 0.05mm/0.05mm
3-6 layers FPC: 0.07mm/0.07mm
Tin plating: 3 μ m-12 μ m
Nickel immersion: 1.5 μ -8 μ m
Gold immersion: 0.015 μ m-0.15 μ m
Golden finger to board side: ± 0.05mm-0.1mm