technical parameter |
|
| Materials | Aluminum Oxide, Aluminum Nitride, Silicon Carbide, Silicon Nitride, ZTA Toughened Ceramics
|
| Plate thickness | 0.127mm 0.25mm 0.38mm 0.5mm 0.635mm 0.76mm 1.0mm 1.5mm 2.0mm 3.0mm |
| Number of layers | Single layer, single-sided, single-layer, double-sided |
| copper thickness | 15-1500um |
| Surface Treatment | Sinking silver, sinking nickel gold, sinking nickel palladium gold, sinking palladium gold, gold tin alloy, copper palladium gold
Electroplated silver tin deposition
|
| Line width and spacing | ≥0.05mm |
| Minimum borehole diameter (mm) | 0.06mm(Conductive hole) |
| Finished aperture tolerance（mm | 0.05mm(Plug in hole) |
| Profile Tolerance | +/-0.05mm |
| Minimum distance from circuit to board edge(mm) | 0.1mm |
| Finished product thickness tolerance(mm) | Finished product thickness tolerance (0.25-0.38mm) ± 0.03mm
Finished product thickness tolerance (0.38-0.635mm) ± 0.04mm
Finished product thickness tolerance (0.76-2.00mm) ± 0.05mm
|
| Hole tolerance | No copper hole+/-0.05mm with copper hole+/-0.076mm |
Application areas: lighting, sensors, high-power module, high thermal conductivity, radar